TSMC, Bosch, Infineon and NXP: Joint venture for chips (2. strana)
TSMC, Bosch, Infineon and NXP establish a joint venture for semiconductor manufacturing
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The planned fab is expected to have
a monthly production capacity of
40,000 300mm (12-inch) wafers on
TSMC’s 28/22 nanometer planar CMOS
and 16/12 nanometer FinFET process
technology, further strengthening Europe’s
semiconductor manufacturing ecosystem
with advanced FinFET transistor technology
and creating about 2,000 direct high-tech
professional jobs. ESMC aims to begin
construction of the fab in the second half
of 2024 with production targeted to begin
by the end of 2027.
The planned joint venture will be 70% owned
by TSMC, with Bosch, Infineon, and NXP
each holding 10% equity stake, subject to
regulatory approvals and other conditions.
Total investments are expected to exceed
10 billion euros consisting of equity injection,
debt borrowing, and strong support from the
European Union and German government.
The fab will be operated by TSMC.
“This investment in Dresden demonstrates
TSMC’s commitment to serving our
customers’ strategic capacity and
technology needs, and we are excited at this
opportunity to deepen our long-standing
partnership with Bosch, Infineon, and NXP,”
said Dr. CC Wei, Chief Executive Officer of
TSMC. “Europe is a highly promising place
for semiconductor innovation, particularly in
the automotive and industrial fields, and we
look forward to bringing those innovations
to life on our advanced silicon technology
with the talent in Europe.”
Dr. Stefan Hartung, chairman of the Bosch
board of management: “Semiconductors are
not only a crucial success factor for Bosch.
Their reliable availability is also of great
importance for the success of the global
automotive industry. Apart from continuously
expanding our own manufacturing facilities,
we further secure our supply chains as
an automotive supplier through close
cooperation with our partners. With TSMC,
we are pleased to gain a global innovation
leader to strengthen the semiconductor
ecosystem in the direct vicinity of our
semiconductor plant in Dresden.”
“Our joint investment is an important
milestone to bolster the European
semiconductor ecosystem. With this,
Dresden is strengthening its position as one
of the world’s most important semiconductor
hubs that is already home to Infineon’s largest
frontend site,” said Jochen Hanebeck, CEO
of Infineon Technologies. “Infineon will
use the new capacity to serve the growing
demand particularly of its European
customers, especially in automotive and IoT.
The advanced capabilities will provide a basis
for developing innovative technologies,
products and solutions to address the global
challenges of decarbonization and
digitalisation.”
“NXP is very committed to strengthening
innovation and supply chain resilience
in Europe,” said Kurt Sievers, President
and CEO of NXP Semiconductors. “We
thank the European Union, Germany,
and the Free State of Saxony for their
recognition of the semiconductor
industry’s critical role and for their true
commitment to boost Europe’s chip
ecosystem. The construction of this new
and significant semiconductor foundry
will add much needed innovation and
capacity for the range of silicon required to
supply the sharply increasing digitalization
and electrification of the automotive and
industrial sectors.”
www.tsmc.com
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