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TSMC, Bosch, Infineon and NXP: Joint venture for chips

TSMC, Bosch, Infineon and NXP establish a joint venture for semiconductor manufacturing

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SPECIAL 2024 T+T TECHNIKA A TRH

TSMC, Bosch, Infineon, and NXP

Establish Joint Venture to Bring

Advanced Semiconductor

Manufacturing to Europe

TSMC (TWSE: 2330, NYSE: TSM), Robert Bosch GmbH, Infineon Technologies AG

(FSE: IFX / OTCQX: IFNNY), and NXP Semiconductors N.V. (NASDAQ: NXPI) today

announced a plan to jointly invest in European Semiconductor Manufacturing

Company (ESMC) GmbH, in Dresden, Germany to provide advanced

semiconductor manufacturing services. ESMC marks a significant step towards

construction of a 300mm fab to support the future capacity needs of the fast-

growing automotive and industrial sectors, with the final investment decision

pending confirmation of the level of public funding for this project. The project is

planned under the framework of the European Chips Act.

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